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NASA’s Passive PCB-Mounted Thermal Switch uses a heat pipe that extends from the electronics enclosure wall to the center of the electronics board. The switch includes a wax actuator that extends when warm. The extending piston on the actuator pushes the heat pipe against the anvil of the mechanism, which then provides a low-resistance heat path to the wall of the enclosure. When the wax actuator drops below a certain temperature, the piston retracts. A spring then pushes the heat pipe away from the anvil, breaking thermal contact and conserving heat. A series of insulating materials is used to reduce unwanted heat transfer through the springs. The mechanism is mounted to the board with a thermal interface material and screws to provide high contact pressure and thermal conductivity between the board and the mechanism. Additional heat straps are used to carry heat directly from particularly hot components. A key advantage of this NASA invention is that it does not require any energy input for operations (i.e., it is completely passive). In spaceflight applications, this enables significant mass savings as heaters can represent up to 50% of electronics systems’ power consumption. Given that typical battery chemistries stop functioning at approximately 0C, additional power is required to keep the batteries themselves warm. Thus, reducing heater power requirements by 50% could reduce overall energy storage requirements by approximately 70% – leaving more capacity for sensors, fuel, or other priorities. NASA’s switch is particularly useful for spaceflight applications where electronics are exposed to long bouts of extreme heat and cold, such as on the Moon (where the day-night cycle lasts 14 days with nighttime lows near -173C and daytime highs near 127C), or in deep space. Lunar landers and lunar infrastructure developers might be ideal end-users of the invention. Other applications where electronics experience extreme temperatures may benefit from this NASA innovation.

This CLAS-ACT is a lightweight, active phased array conformal antenna comprised of a thin multilayer microwave printed circuit board built on a flexible aerogel substrate using new methods of bonding. The aerogel substrate enables the antenna to be fitted onto curved surface. NASA's prototype operates at 11-15 GHz (Ku-band), but the design could be scaled to operate in the Ka-band (26 to 40 GHz). The antenna element design incorporates a dual stacked patch for wide bandwidth to operate on both the uplink and downlink frequencies with a common aperture. These elements are supported by a flexible variant of aerogel that allows the material to be thick in comparison to the wavelength of the signal with little to no additional weight. The conformal antenna offers advantages of better aerodynamics for the airframe, and potentially offers more physical area to either broadcast further distances or to broadcast at a higher data rate. The intended application for this antenna is for UAVs that need more than line of sight communications for command and control but cannot accommodate a large satellite dish. Examples may be UAVs intended for coastal monitoring, power line monitoring, emergency response, and border security where remote flying over large areas may be expected. Smaller UAVs may benefit greatly from the conformal antenna. Another possible application is a UAV mobile platform for Ku-band satellite communication. With the expectation that 5G will utilize microwave frequencies this technology may be of interest to other markets outside of satellite communications. For example, the automotive industry could benefit from a light weight conformal phased array for embedded radar. Also, the CLAS-ACT could be used for vehicle communications or even vehicle to vehicle communications.

Advances in additive manufacturing have enabled development of printable electronic sensor elements that can be deposited onto flexible substrates. To benchmark performance of printed sensors against the state of the art, NASA developed a low power flexible sensor platform. The platform integrates the following key components and features: -Flexible substrate: DuPont Kapton allows bending around cylindrical surfaces as small as in diameter. -Embedded microcontroller: Cypress CY8C4248 LQI-BL583 Arm Cortex M0 processor with BLE wireless controller, max frequency 48 MHz. Supports low power modes of operation, capacitive sensing support, and a single-channel 12-bit AD converter. -Commercial sensor suite: Bosch BNO080 inertial sensor; Bosch BME280 humidity, pressure, and temperature sensor; AMS CCS811 air quality sensor (VOCs and CO2). -Prototyping area for custom-printed sensors: 1) thermistor, uses carbon-based PTC resistor paste DuPont2792; 2) capacitive humidity sensor using a NASA-developed dielectric ink. NASA researchers have used the platform to study performance of the printed capacitive humidity sensor. The 2x4 mm co-doped barium titanate sensing element is highly sensitive to water vapor and performs as an unobtrusive breathing monitor, sensitive to breath at distances of up to 20 cm. Average change of sensor capacitance at a distance of 7.5 cm was observed to be 6.23.5 pF.